PITek Basis of Particle Interconnect Technology
Basis of Particle Interconnect technology. Particle Interconnect PI overview. Controlled impedance to lead of package die pad. SEM, FIB, AFM pictures of metal. SEM pictures of Particle Interconnect. Optical Microscope pictures of PI. Standard wiping contact spalling. TDR, S parameter, Eye diagrams. Close-up of Particle Interconnect pads shows controlled stacking of particles to a desired height with clearance between individual particles. Particle Interconnect PI overview. Eliminating wirebonding.
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Louis Di Francesco
31032 Herhshey Way
Hayward, California, 94544
United States US
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PITek Basis of Particle Interconnect TechnologyDESCRIPTION
Basis of Particle Interconnect technology. Particle Interconnect PI overview. Controlled impedance to lead of package die pad. SEM, FIB, AFM pictures of metal. SEM pictures of Particle Interconnect. Optical Microscope pictures of PI. Standard wiping contact spalling. TDR, S parameter, Eye diagrams. Close-up of Particle Interconnect pads shows controlled stacking of particles to a desired height with clearance between individual particles. Particle Interconnect PI overview. Eliminating wirebonding.PARSED CONTENT
The web page states the following, "Controlled impedance to lead of package die pad." We saw that the web site said " SEM, FIB, AFM pictures of metal." It also said " SEM pictures of Particle Interconnect. Optical Microscope pictures of PI. TDR, S parameter, Eye diagrams. Close-up of Particle Interconnect pads shows controlled stacking of particles to a desired height with clearance between individual particles."ANALYZE SUBSEQUENT BUSINESSES
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